Figure 4-3. Honeycomb and Composite Structures
This setup is very sensitive to thin skin-to-core bonding. If the panel skin is 0.020 inch thick or
less, move the probe slowly over the skin and note the slight amplitude change (bounce) as the
probe senses alternately the honeycomb cell nodes and cell walls. Be sure of panel
configuration. Panel edges and attachment points may not be bonded structure and do not
normally contain honeycomb. These areas will respond similarly to voids with the Bondmaster.
Panels having rigidized skins are more easily scanned using wide Teflon tape on the probe
Marking and Recording of Inspection Results. Mark and record as required by paragraph 1.3.
Attention shall be directed to accurately marking the boundaries of all voids on both sides of the
panel. These markings will be needed to determine acceptance/rejection criteria in accordance
with the applicable technical manuals listed in Table 1-1.
4.3.4 Backup Method. None required.
4.3.5 System Securing. Reinstall acceptable panels that were removed for inspection in accordance with the applicable
technical manual listed in Table 1-1.