TM 1-1520-265-23
4.3.3.5
NDI Equipment Settings. Refer to Bond Testing Equipment, paragraph 1.4.6.1.
a.
Attach cable and probe to Bondmaster. Protect probe with Teflon tape and install in probe holder.
b.
Turn on Bondmaster, press SPCL, and make the following adjustments.
H Pos
-40%
V Pos
- 80%
PHASE REF
- O
DRIVE
- MID
c.
Press SET and select DISPLAY - PHASE.
d.
Place probe on good area of test block and press GOOD PART. Do this several times while moving the probe to
different spots in the good area of the test block. Note the video signature for each. Select and enter a
representative good area by pressing GOOD PART one last time.
e.
Place probe on void area of the test block and press BAD PART. Do this several times while moving the probe
slightly to different positions within the void area. Select and enter a position that gives a strong difference
between good and void areas. Use DIFF soft key to observe difference between good and bad areas of test
block.
NOTE
If during setup the flying spot deflects upward, or to the side, when the probe passes over the
bad part, instead of the desired down deflection toward the alarm box, press SPCL and toggle to
a different phase setting (90, 180, or 270), and repeat steps d. and e. Continue to try phase
setting until the flying spot moves in the desired down direction.
f.
Place probe on good area of test block and press RUN. Flying spot should be near the top-center of the ACTIVE
screen. If not, press NULL. Slide probe from good to void area and note response from flying spot. This
response should provide both amplitude (vertical) and phase (horizontal) movement. The default gate/alarm
setting may be incorrect for this set- up. Turn off or reset gate/alarm as desired.
g.
The Bondmaster is programmed to automatically set test parameters to a start-up or initial bond test. By
following the steps outlined above, adjustments to the FREQ, GAIN, and ALARM can help to refine the
selectivity in locating defects among differing composite materials.
4.3.3.6
Inspection Procedure. Refer to Bond Testing Method, paragraph 1.4.6 and inspection areas shown in Figure 4-
3. Place probe in location where test for void is desired and press NULL. Move probe from good to suspect area and
note response. A strong amplitude change and phase shift similar to the test block is indicative of a void.
4-8
